• T870A BGA Repairing Machine/ Infrared BGA Rework Station
  • T870A BGA Repairing Machine/ Infrared BGA Rework Station
  • T870A BGA Repairing Machine/ Infrared BGA Rework Station
  • T870A BGA Repairing Machine/ Infrared BGA Rework Station
  • T870A BGA Repairing Machine/ Infrared BGA Rework Station

T870A BGA Repairing Machine/ Infrared BGA Rework Station

Power: 1000W
Transport Package: 1PC/Carton
Specification: CE
Trademark: PUHUI
Origin: Shandong, China
Customization:
Gold Member Since 2010

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Rating: 5.0/5
Manufacturer/Factory & Trading Company

Basic Info.

Model NO.
T870A
HS Code
8515110000
Production Capacity
600PCS/Month

Product Description

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Maintenance and overhaul:
1. Complete machine maintenance:
After the machine has been used for a period of time, clean the focusing frame, the guide
rod, the PCB board support and the sliders and treat them with a lubricant to protect them
from rust.
2, Preheating chassis and infra-red lamp body maintenance:
Clean the pre heating chassis and in particular the infrared lamp body with dehydrated
alcohol. Otherwise residue from evaporated soldering paste could otherwise decrease
the effectiveness of the infrared lamp.
3, Infra-red lamp replacement:
Use a special inside caliper gauge or a pair of long mouth pliers to first take out
the inside spring. Then push the lamp gently out of the body through the air vent.

T870A BGA Repairing Machine/ Infrared BGA Rework Station

Power: 1000W
Voltage: AC110V-220V 50/60Hz
Infrared lamp body power: 150W
Preheating plate power: 800W
Working bench size: 360*240mm
Infrared lamp body heating size: 50*50mm
Preheating plate size: 240*180mm
Preheating plate temperature range: 60-200C
Infrared lamp body temperature range: 200-450C

T870A BGA Repairing Machine/ Infrared BGA Rework Station
Features:

1. Infrared welding technology.
2. Infrared heating, can avoid the IC damage due to the fast or uninterrupted heating up.
3. Easy operate; User can operate skillfully after one-day training.
4. No need welding tools, it can weld any chips under 50mm.
5. With 800W hot melt system, preheating range 240*180mm.
6. It doesn't impact the smart parts without hot air, and suits to weld BGA, SMD, CSP, LGA, QFP, PLCC and BGA reballing.
7. It suits for a variety of computer, notebook, play station's BGA components, especially in a Northbridge/ Southbridge chipset of computer.

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