Note: When the peak temperature is below 248, lamplight will be continuously, intermittent heating.

(4) After the lamp holder replacement, according to the size of chips, adjust the focusing knob. Make the bright spot cover the whole chip.
(5)Before unsolder chip, inject a small quantity of flux in the bottom of a chip or side can get good solder beading, at the same time, can protect bonding pad, and make unsoldering process more fluent.
(6)At the appropriate time, the tin points will be melted then remove the chip. It takes 20-40s or so when unsoldering less than15x15mm chips, it takes 30-60s, if the area of the chips between 15x15mm-30x30mm, it takes60-90s, when the area of the chips more than 30x30mm.

Unlike Air Re-Work systems, The T-862 uses an Infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.

Infrared soldering technology with independent exploration capabilities via the focus lenses which is included in the package.

Technician focused infrared heat is easy to target most component removal/replacement and re-work.

The Workstation has a 80*20mm a 600W controlled Pre-heating System.

Infrared heat source bulbs are long-lived, in-expensive and easily replaced.

Processor controlled set-point regulated temperatures with thermocouple feed-back.

Integrated and adjustable Infrared (IR) eye protection.

Can suitable for the entire component, especially Micro BGA component.

The T-862 system also contains a temperature controlled touch-up iron and stand.

Extra soldering tools are not necessary to solder/unsolder and re-work Surface Mount Technology (SMT) components18*18cm in size

Training is illustrated in factory provided video.