Mobile phone bga repairing tools T-862++
Can suitable for the entire component, especially Micro BGA component.
The T-862++ system also contains a temperature controlled touch-up iron and stand.
Extra soldering tools are not necessary to solder/unsolder and re-work Surface Mount Technology (SMT) components 15-35cm in size.
Training is illustrated in factory provided video.
Unlike Air Re-Work systems, The T-862++ uses an Infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.
Infrared soldering technology with independent exploration capabilities via three (3) focus lenses which are included with the package.
Technician focused infrared heat is easy to target most component removal/replacement and re-work.
The Workstation has a 120 X120mm a 650W controlled Pre-heating System.
Infrared heat source bulbs are long-lived, in-expensive and easily replaced.
Processor controlled set-point regulated temperatures with thermocouple feed-back.
Integrated and adjustable Infrared (IR) eye protection.
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