T-962 infrared bga reflow oven, mini reflow oven
Technical parameters 962
Soldering area: 180*235mm
Overall dimensions: 31*29*17cm
Packing dimensions: 37.5*24*37.5cm
Power: 800W
Cycle time: 1-8 min
Voltage: AC110V-AC220V /50-60HZ
Net weight: 6.2Kgs
Gross weight: 7.5Kgs
FEATURES
(1) A large infrared soldering area
Soldering area: 180*235mm (T-962), this increases the usage range of this machine drastically and makes it an economical investment.
(2) Choice of different soldering waves
Parameters of eight soldering waves are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.
(3) Special heat up and temperature equalization with all designs
Big power of energy efficient Infrared heating and air circulation to re-flow solder.
(4) Ergonomic design, practical and easily operated
Good build quality but at the same time light weight and a small footprint allows the T962 to be easily bench positioned transported or stored.
(5) Large number of available functions
Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.
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