Infrared BGA Reflow Oven, Infrared IC Heater T962

Product Details
Customization: Available
Certification: CE
Automatic Grade: Automatic
Still deciding? Get samples of US$ 160/Piece
Request Sample
Manufacturer/Factory & Trading Company
Gold Member Since 2010

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Number of Employees
43
Year of Establishment
2007-05-10
  • Infrared BGA Reflow Oven, Infrared IC Heater T962
  • Infrared BGA Reflow Oven, Infrared IC Heater T962
  • Infrared BGA Reflow Oven, Infrared IC Heater T962
  • Infrared BGA Reflow Oven, Infrared IC Heater T962
  • Infrared BGA Reflow Oven, Infrared IC Heater T962
  • Infrared BGA Reflow Oven, Infrared IC Heater T962
Find Similar Products

Basic Info.

Model NO.
T962
max soldering area
180*235mm
size
31*29*17cm
packing size
37.5*24*31.5cm
rated power
800W
process period
1-8min
supply
AC 220V/110V 50-60HZ
gross weight
7.5kg
Transport Package
carton size: 37.5*24*37.5cm
Specification
220V/110V AC 50-60HZ
Trademark
Puhui
Origin
Tai′an City, Shandong Province, China
HS Code
85141090
Production Capacity
150pcs/month

Product Description

T-962 infrared bga reflow oven, mini reflow oven

Infrared BGA Reflow Oven, Infrared IC Heater T962

Technical parameters 962
Soldering area: 180*235mm
Overall dimensions: 31*29*17cm
Packing dimensions: 37.5*24*37.5cm
Power: 800W
Cycle time: 1-8 min
Voltage: AC110V-AC220V /50-60HZ
Net weight: 6.2Kgs
Gross weight: 7.5Kgs




Infrared BGA Reflow Oven, Infrared IC Heater T962
Infrared BGA Reflow Oven, Infrared IC Heater T962
Infrared BGA Reflow Oven, Infrared IC Heater T962 Infrared BGA Reflow Oven, Infrared IC Heater T962



FEATURES
(1) A large infrared soldering area
Soldering area: 180*235mm (T-962), this increases the usage range of this machine drastically and makes it an economical investment.

(2) Choice of different soldering waves
Parameters of eight soldering waves are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.

(3) Special heat up and temperature equalization with all designs
Big power of energy efficient Infrared heating and air circulation to re-flow solder.

(4) Ergonomic design, practical and easily operated
Good build quality but at the same time light weight and a small footprint allows the T962 to be easily bench positioned transported or stored.

(5) Large number of available functions
Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.

Infrared BGA Reflow Oven, Infrared IC Heater T962
Infrared BGA Reflow Oven, Infrared IC Heater T962
Infrared BGA Reflow Oven, Infrared IC Heater T962
Infrared BGA Reflow Oven, Infrared IC Heater T962

Emmy sun
Overseas manager
Tai'an Puhui Electric Technology Co.,Ltd.
Wohushan South Road, Dai yue District, Tai'an City, Shandong Province, China
 
 
 

 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier