Infrared IC Heater Lead-free Reflow Oven T962A
1)Technical parameters
| Soldering area |
300*320mm |
| Overall dimensions |
43*37*26cm |
| Packing dimensions |
51*45*33cm |
| Power |
1500W |
| Cycle time |
1-8 min |
| Voltage |
AC110V-AC220V /50-60HZ |
| Net weight |
12.5Kgs |
| Gross weight |
15Kgs |
2) Description
Micro-processor controlled reflow oven, suit for various soldering of SMD/BGA automatically, easy operate; Fast infrared and hot air heating, make temperature more accurate and evenness. Fuzzy temperature control technology, visualization drawer, can see the whole soldering process very clearly. It can achieve soldering of single and double-sides PCB board.
3) FEATURES
1. A large infrared soldering area
Soldering area: 180*235mm (T-962), 300*320mm (T-962A); This increases the usage range of this machine drastically and makes it an economical investment.
2. Choice of different soldering waves
Parameters of eight soldering waves are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.
3. Special heat up and temperature equalization with all designs
Big power of energy efficient Infrared heating and air circulation to re-flow solder.
4. Ergonomic design, practical and easily operated
Good build quality but at the same time light weight and a small footprint allows the T962 to be easily bench positioned transported or stored.
5. Large number of available functions
Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.
Warranty
Warranty the main body maintains for one year and the spare parts maintains for three months.
Service provide the immediate network online Q/A and the technical advisory work service
Delivery
Safe packing and fast delivery by air express.
Description of products
(1) Large infrared soldering area: 300*320mm (T-962A)
(2) Eight soldering waves
(3) Special heat up and temperature equalization
Big power of energy efficient Infrared heating and air circulation to re-flow solder.
(4) Ergonomic design, practical and easily operated
(5) Large number of available functions
Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.
Technic parameter
Soldering max area: 30× 320 cm
Size: 43× 37× 26cm
Packing size: 50× 43× 33 cm
Rated power: 1500W
Process Period: 1~8 min
Supply: AC110V~ AC220V /50~60Hz
Net weight: 12.5kg
Gross weight: 14.0kg
Warranty
Warranty - the main body maintains for one year and the spare parts maintains for three months.
Service - provide the immediate network online Q/A and the technical advisory work service
Delivery
Safe packing and fast delivery by air express.
Jack
Overseas manager
Tai'an Puhui Electric Technology Co.,Ltd.
Wohushan South Road, Dai yue District, Tai'an City, Shandong Province, China
Audited Supplier 
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