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Power: 1000W Voltage: AC110V-220V 50/60Hz Infrared lamp body power: 150W Preheating plate power: 800W Working bench size: 360*240mm Infrared lamp body heating size: 50*50mm Preheating plate size: 240*180mm Preheating plate temperature range: 60-200C Infrared lamp body temperature range: 200-450C
Features:
1. Infrared welding technology which was developed independently. 2. Infrared heating is easy to pierce and distribute evenly, can avoid the IC damage due to the fast or uninterrupted heating up. 3. Easy operate; User can operate skillfully after one-day training. 4. No need welding tools, it can weld any chips under 50mm. 5. With 800W hot melt system, preheating range 240*180mm. 6. It doesn't impact the smart parts without hot air, and suits to weld BGA, SMD, CSP, LGA, QFP, PLCC and BGA reballing. 7. It can suit for a variety of computer, notebook, play station's BGA components, especially in a Northbridge/ Southbridge chipset of computer.
Warranty Warranty the main body maintains for one year and the spare parts maintains for three months. Service provide the immediate network online Q/A and the technical advisory work service