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Desktop Reflow Oven, Best Quality Reflow Oven, Wave Solder, Hot Air Reflow Oven, T962A Reflow Oven, PCB Soldering Machine, Hot Air Reflow Oven

Packing Size:	5144.533cm
Rated Power:	1500W
Process Period:	1--8min
Temperature Range:	0-280
Gross Weight:	15kg
Max Soldering Area:	300*320mm

Customization:	Available \| Customized Request

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